Infineon Technologies AG claims it is the first semiconductor supplier to offer VoIP functionality for low-cost mobile phones, enabling operators to offer fixed-mobile convergence by integrating Wi-Fi on its mobile phone platform. According to Infineon, the solution, the XMM 1013, will help reduce BOM cost for Wi-Fi-enabled cellphones by up to 50 percent compared to existing solutions. The XMM 1013 integrates Infineon's single-chip X-GOLD 101 cellular solution and Atheros' single-chip AR6101 ROCm VoIP solution.
"While many people want to make inexpensive VoIP phone calls at home and on-the-go (or while travelling), there is a growing demand for easy-to-use handsets with accessibility to GSM mobile networks as well as Wi-Fi hotspots", said Weng Kuan Tan, vice president and general manager of the entry phone business unit at Infineon's communication solutions business group. "Our field proven and best-selling low-cost solution paired with Atheros' wireless VoIP system enables attractive price points for new, dual-mode handsets that offer users savings through VoIP calls at any open access point."
The XMM 1013 platform is sampling to handset manufacturers now and volume production starts in Q2 08.
Sunday, March 23, 2008
Infineon answers VoIP feature in low-cost handsets
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